Scrap Rate Reduction.
Scrap is an unavoidable reality in electronics manufacturing. As PCBAs become increasingly complex, yield losses caused by solder defects, design errors, delamination, or layer mismanagement can quickly accumulate. Even the highest-performing manufacturers, achieving First Pass Yield rates of 98–99%, still face significant losses across high production volumes.
When scrap occurs, the traditional approach is simple: discard the board. Unfortunately, this also discards the valuable components attached to it. Once soldered and removed through conventional processes, many components become damaged or contaminated, preventing them from being reused.
The consequences are both economic and environmental. Valuable materials and components must be replaced with newly manufactured parts, increasing production costs and driving additional resource extraction.
In2tec ReUSE® PCBAs offer an alternative. Through the ReCYCLE™ process, boards can be “unzipped,” allowing components to be removed intact and uncontaminated. Instead of entering the scrap stream, components can be recovered and returned to production.
This dramatically reduces scrap rates while preserving the value already embedded in components and materials. By turning failed assemblies into recoverable resources, manufacturers can minimise waste, reduce reliance on new material extraction, and improve overall manufacturing efficiency.
Our new facility is the world’s first to truly close the loop in PCBA manufacturing, delivering full component recovery and zero-waste potential.
Explore what fully circular electronics means for your business and the planet.
#SustainableElectronics #FirstLifeYield #Manufacturing #ReCYCLE™
