Flexible electronics doesn’t just define the ability of the Printed Electronic Circuit to deliver dynamic movement, or in fact, conclude in a project that is continually able to ‘flex’.
Providing substrates and electronics that can be designed in such a way as to deliver a shape or form, but with a mechanically rigid superstructure or moulded support, breaks down the design and application barriers to minimise restrictions in packaging and aesthetics.
In2tec provides the technology to laminate or thermally form and bond Flexi-hibrid™ circuit board electronic assemblies to substrates, creating rigidity, and semi-rigidity to meet the customer function, form, and sustainability needs.
