Flexi-hibrid™ development delivers significantly more electronic component integration for single moulded products through OMSE™, a technology that vastly reduces component count, whilst increasing complexity, and integrates patented flat-shielded electrical wiring systems.
This technology delivers fully unzippable bonded conductive traces, printed sensors, and electronic and mechanical components onto a sustainable substrate. These systems are referred to as Flexi-hibrid™ electronic technologies.
The flexible circuit board can be formed and laminated using ReUSE® bonding materials to a pre-vac formed or injection moulded one-piece front shield. The rear of the front shield incorporates cavities to house the components of the Flexi-hibrid™ sub-assembly therefore fully protecting the electronics whilst allowing full end-of-life disassembly and recyclability. The ‘harness’ or connecting system is also created by using an additive process to the FHE substrate, creating a seamless and fully integrated interconnection system significantly minimising connectors.