The growing trend to integrate electronics into single moulded products through IME techniques is changing the design boundaries for markets such as Automotive. Today the focus is mostly on delivering plastic injection moulding process to minimise the impact on the electronics.
In2tec has taken a different and more beneficial approach, addressing the challenges around integration, cost, space, and sustainability.
We call this technology OMSE™, On-Mould Sustainable Electronics.
Laminating complex or simple electronic foils onto injection moulded superstructures produces the highly integrated, fully sealed unit via traditional low-cost moulding techniques, allowing customers to continue using their current business model.
Our unique component placement capabilities remove the need for a separate board to drive the interface, providing game-changing single system designs that reduce logistical and design barriers. Incorporating our printed shielded pair communication interconnects also allows In2tec to considerably reduce component counts, inherently bringing increased reliability and flexibility together with a quantifiable energy reduction of over 60% versus conventional FR4.
OMSE™ is world-leading as a technology that meets the sustainable and circular goals of our customers.
Our patented ReUSE® technology delivers recyclable single moulded products with fully unzippable electronics circuit assemblies. Our ReCYCLE™ process offers an end-of-life solution that delivers complete back-to-BOM opportunity via low-energy harvesting.